3 Packaging Technologies in the Manufacturing of LED Lights

Recently, more and more people are using LED lights. However, they may have some questions such as “How are LED lights manufactured?” ”What are packaging technologies used in the manufacturing of LED lights?” This article answers those questions.

Generally speaking, the high-power LED packaging technology can be divided into single chip packaging, multi-chip integration packaging and chip on board packaging.

 

The single chip packaging is the most popular in the world due to its high luminous efficiency, good heat dissipation, easy light distribution and reliability. But, the main obstacles for single chip packaging are chip yield, color temperature control and phosphor coating technology. Now, we can see a good example (picture1) for the single chip packaging. The LED is packaged with silica gel and has a beam angle of 170 degrees, ideal with secondary optical lens or reflector cup, its silicone lens has the feature of high temperature resisting and low attenuation. The unique packaging design can further enhance the thermal performance. In addition, LED color temperature covers the range of cool white, neutral white and warm white because of the specific preparation of the phosphor.

 

single chip packaging

(picture 1)

 

The multi-chip integration packaging is another most common technology for high-power LED because it can achieve a high luminous flux within a very small space. The multi-chip integration also can divided into low-power and high-power integration. The most typical form for lower-power integration is the 1-watt high-power LED integrated with 6 low-power chips. The great advantage of low-power integration is low cost and it is becoming the main way of high-power LED manufacturing. The high-power integration is shown as picture 2. The heat resistance of the final product can be controlled within 3.1℃ per watt by optimizing design and can drive high power of 15 watts.

 

multi-chip integration packaging

(picture 2)

 

The chip on board (COB) packaging adopts the traditional semiconductor technology, that is, directly fix the LED chips to the printed circuit board (PCB). There is the LED whose thickness is less than 0.3mm in the market by using COB technology. The direct contact with PCB enlarges the area of heat transfer so that the heat dissipation problem can be greatly improved. This package is mainly based on low-power chips.

 

Winson Lighting is a company that offers a wide range of low and main voltage, eco-friendly, energy efficient and cool running LED lights for homes, offices, shops, cars, boats or caravans. For more information visit their site at http://www.winson-lighting.com.